Your IC failed for unknown reason? It's hard to say what went wrong without removing the black encapsulation. Some people use strong acids or torches, but there is the laser method too.
The laser light is easily absorbed by the epoxy and highly reflected by metals. The absorption difference can be used to vaporize the encapsulation material.
How it works:
(Basic Package) You send me your IC (any size), I do the decapsulation and take some photos under the microscope. After encapsulation you will likely see which gold wire is burned through and what is damaged. You will have to take care of postage of the IC to Switzerland.
(Advanced Package) You send my the damaged IC and a undamaged spare. I decapsulate first the spare and locate the semiconductor components. I decapsulate the package without damaging the semiconductor part. I will take extra care of decapsulating the damaged IC: minimal heat load, removing only the the material from the wire bonds. After that I will send you back your damaged IC so you can do further measurements and analysis on it.
A discount is always available if more components need to be processed. - Please enquire.